Speaker voice chip solution: intelligent voice dialogue audio amplifier chip

With the advancement of technology, voice chips are increasingly used in various fields. Among the many voice chips, the intelligent voice dialogue speaker voice chip is gradually becoming a leader in the audio application field with its unique advantages.

Intelligent audio power amplifier chips are an indispensable part of various types of speakers, headphones and other equipment; audio power amplifier chips, commonly known as “amplifiers”, are the most basic equipment in the audio system and are responsible for amplifying weak electrical signals from the signal source. To drive speakers to produce sound, thereby transmitting the sound to our auditory system. Nowadays, most audio power amplifier chips can integrate voice control functions.

Geyuan Electronics has developed a variety of smart voice dialogue audio chips for speaker solutions in response to market demand. This article mainly introduces the parameters and advantages of one of the GY7012F6 chips.

GY7012F6 solution customized development ideas

Nowadays, with the popularity of artificial interaction and smart home, smart audio power amplifier chips are also increasing in sales of audio smart terminals represented by smart speakers and smart homes. It is believed that the demand for audio power amplifier chips will continue to grow in the future. The development ideas of Geyuan Electronics’ audio power amplifier chips are as follows:

240×240@25fps
Plug-in Flash
Bluetooth call
Local playback
Connect Bluetooth headset
BT V5.3 dual-mode BR+EDR+BLE

GY7012F6 speaker voice chip solution specific parameters

As a home device, smart speakers have broad prospects for “one machine, one household”. Smart voice will become a major topic. According to industry forecasts, the concept of smart home is becoming more and more popular, and smart speakers, as one of the important entrances to control smart homes, have also become the focus of manufacturers. If manufacturers of related products want to choose a suitable audio power amplifier chip, in addition to understanding the development ideas of related solutions, they also need to have an in-depth understanding of the specific parameters of each model of chip. The specific parameters of the GY7012F6 chip developed by Geyuan Electronics are as follows:

1.SRAM: 640KB
Built-in Flash size: 16Mbit
3.Support: Plug-in Flash
Support: Sensor Hub
Support: 2D graphics acceleration
6.RF Tx/Rx: 9dBm/-95dBm
Built-in charging maximum current: 220mA
8.GPIO: 39QS
9.PI/SPI: 4xSPI
10.USB: usb2.0
Support: MUC-8080
Support: RGB
Support: EMMC/SD
Support: I2C/UART

Advantages of GY7012F6 audio power amplifier

With its high integration, low power consumption, strong compatibility and expandability, GY7012F6 can be widely used in multiple scenarios and has the following obvious advantages:

Dual-core CPU + large-capacity RAM

Geyuan Electronics’ ultra-low-power Bluetooth smart speaker chip – GY7012F6, has a 32-bit dual-core CPU design and large-capacity RAM, with a maximum computing power of 192MHZ. It can handle massive processing resources and facilitate the implantation of various audio algorithms.

Stronger audio performance and better noise floor performance

GY7012F6 adopts SBC/mSBC encoder and decoder, supports multiple audio decoding formats such as AAC, APE, FLAC, MP3, etc., has three-band balanced high, high and low frequencies to adjust the sound effects independently, supports the new generation of ENC active noise reduction technology, and multi-band DRC dynamic compression mode. , supports dual-channel 24-bit DAC, SNR ≥ 104dB, and supports four-channel 24-bit ADC, SNR ≥ 95dB, making GY7012F6 have better DAC, ADC performance and better noise floor performance compared with other models of Bluetooth speakers. .

Built-in interrupt wake-up, supports audio broadcast

The sound is more transparent, and the realistic feeling is immersive. Built-in voice interrupt wake-up technology allows you to control the speaker from a distance without touching it. One-to-many speakers can be used for audio broadcasting, and large-area speaker networking and multi-scene audio modes can be easily realized.

Speaker voice chip solution development and customization process

Geyuan Electronics’ customized solution project cooperation process is as follows

①Business docking﹙Project docking﹚

② Confirm requirements ﹙ Provide detailed functional requirements: prototype, PCB, etc. ﹚

③Selection quotation﹙Chip quotation, solution quotation, development time﹚

④Project development ﹙Program development, hardware debugging﹚

⑤Test sample delivery﹙First version procedure﹚

⑥Project acceptance ﹙ Fine-tuning and modification﹚

⑦Completion of the project﹙Closed and put into production﹚

Summarize

With the rapid development of artificial intelligence, Internet of Things and other technologies, the application prospects of smart audio power amplifier chips will be broader. In the future, this chip is expected to be deeply integrated with AI technology to achieve more intelligent audio processing and broadcasting functions. At the same time, in fields such as smart homes and autonomous driving, smart audio amplifier chips are also expected to play an important role in creating a more intelligent and convenient life experience for people.

The series of digital power amplifier chips developed by Geyuan Electronics have high sound quality, low power consumption and low manufacturing cost. They are very suitable for currently popular and fast-growing application products such as: audio system solutions, home smart projectors, smart speakers, TVs and other smart homes. ; Closer to customer market needs.